86-13913128991 
DIP is an electronic component packaging technology commonly used for components installed on PCBs such as integrated circuits, crystal oscillators, inductors, and capacitors.
The characteristic of this technology is that it is arranged neatly, easy to install, and can achieve high-density layout, which helps to improve the performance and reliability of the circuit.
Can produce product widths of 50mm-450mm.
Three stage micro hot air circulation preheating for more uniform temperature.
PC+PLC electronic control system, more stable and intelligent.
Curve splitting machine, programmable for cutting various irregular panels.
The cutting and splitting machine ensures more stable V-cut splitting quality and avoids internal damage to PCB circuits or welding joints.
Optical alignment, chip mounting alignment accuracy of 0.01mm.
Infrared tube+hot air heating for more uniform heating.
The three heating zones are controlled using independent PID algorithms, with a temperature control accuracy of ± 1 ℃.
Comprehensive 3D support, using technologies such as trapezoidal acceleration and deceleration, speed foresight, and micro line interpolation, can achieve high-speed continuous motion of any 3D spatial curve.
The resolution reaches 0.01mm, the axial speed range is 0.1-800mm/s, and the repeatability accuracy is ± 0.01mm.
The TR series water-cooled laser has a small output laser light, narrow pulse width, and can achieve more precise processing effects. It can achieve plastic marking and glass marking.
86-13913128991 
Haoxw@idea-link.com.cn 
