86-13913128991 
Fully automated SMT Chip Processing Production Line.It is an efficient electronic manufacturing production line that can achieve automated welding of circuit boards.
This production line consists of multiple automated equipment, including printing machines, SMT machines, reflow welding machines, testing equipment, etc.
MPM125 and Panasonic SP18 are both classic equipment in the field of fully automatic solder paste printing machines, known for their high accuracy and stability
GKG G9+ is a rising star in the fully automatic solder paste printing machine industry, printing 0201 "and Pitch 0.35mm IC.
SMT project |
Process capability |
PCB Size |
50 * 50~750 * 550mm (using fixtures for<50mm) |
PCB board thickness |
0.3-4mm (using fixtures thinner than 0.5mm) |
Component size |
0201″～100*90*25mm |
BGA/QFP/CSP |
5*5～45*45mm |
Component spacing |
IC minimum spacing 0.3mm, BGA minimum spacing 0.4mm |
Component height |
Up to 15mm |
Number of feeding stations |
286 (8mm)+20 Trays |
Placement accuracy |
Chip ± 0.040mm; QFP ± 0.035mm |
SMD capability |
8 million points/day |
Koh Young SPI is a reliable SPI in the industry with a market share of over 50%. Ensure the printing quality of the 0201 pad and the 0.25mm ball diameter BGA pad.
JTR-1000-N/JTR-100 reflow soldering has precise temperature and good insulation performance. Nitrogen protection can prevent oxidation, improve welding wetting force, reduce solder balls, avoid bridging, and reduce BGA bubbles. The actual nitrogen oxygen content in reflow soldering can reach below 800PPM.
AOI for each SMT line standard configuration.
Fully meet the detection requirements for 0201 devices and 0.35mm pins with a pitch.
Dedicated and professional engineers debug to ensure the effectiveness of testing.
The maximum product size that can be inspected is 550 * 550mm. Closed tube, 90KV can tilt 60 degrees, high-definition FPD, pixel matrix 1536 * 1536, can automatically calculate BGA bubble ratio.
86-13913128991 
Haoxw@idea-link.com.cn 
