86-13913128991 
The company is equipped with five Panasonic high-speed SMT lines, each standardly configured with 3D SPI, nitrogen reflow soldering, and AOI.
The fully automated SMT assembly production line is an efficient electronic manufacturing production line capable of achieving automated soldering of circuit boards.
Idealink's SMT process includes: PCB hard board assembly, FPC flexible board assembly, and component mounting on plastic parts.
MPM125 and Panasonic SP18 are both classic equipment in the field of fully automatic solder paste printing machines, known for their high accuracy and stability
GKG G9+ is a rising star in the fully automatic solder paste printing machine industry, printing 0201 "and Pitch 0.35mm IC.
Category |
Project |
Technical Specifications |
Performance |
X/Y/Z Repetitive positioning accuracy |
±18um@4 sigma (CPK＞1.33) |
Positioning Accuracy |
±35um@4 sigma (CPK＞1.33) |
|
Motion Driven Mode |
Servo motor+screw rod |
|
XY maximum speed |
800mm/s；0.8g |
|
Z maximum speed |
400mm/s；0.2g |
SMT project |
process |
PCB size |
50*50～750*550mm(<50mmUsing fixtures) |
PCB plate thickness |
0.3～4mm (thin0.5mmUsing fixtures) |
Component size |
0201″～100*90*25mm |
BGA/QFP/CSP |
5*5～45*45mm |
Component spacing |
IC minimum spacing0.3mm,BGA minimum spacing0.4mm |
Component height |
highest15mm |
Number of feeding stations |
286(8mm)+20 Tray |
SMT accuracy |
chip ±0.040mm ；QFP ±0.035mm |
SMT capability |
8 million points per day |
Koh Young SPI is a reliable SPI in the industry, with a market share of over 50%. Ensure the printing quality of 0201 pads and 0.25mm ball diameter BGA pads.
JTR-1000-N/JTR-100 reflow soldering has precise temperature and good insulation performance. Nitrogen protection can prevent oxidation, improve soldering wetting force, reduce solder balls, avoid bridging, and reduce BGA bubbles. The actual nitrogen oxygen content in reflow soldering can reach below 800PPM.
Each SMT line comes standard with a German AOI；
Fully meet the requirements of 0201 device and pin detection with a pitch of 0.35mm；
Full time professional engineers debug to provide assurance for testing results.
he maximum product size that can be inspected is 550 * 550mm. Closed tube, 90KV can be tilted 60 degrees, high-definition FPD, pixel matrix 1536 * 1536, can automatically calculate BGA bubble ratio.
86-13913128991 
Haoxw@idea-link.com.cn 
